Substrate size | M substrate (330×250mm) | ○ |
Element size | Laser identification | 0603 chip(0201) inch chip~20mm components |
or 26.5×11mm*1 |
(0402(01005) |
Portrait recognition | standard | 1.0×0.5mm~20mm components |
option | 0.3mm ~16mm |
Component placement accuracy*2 | Laser identification | High precision components | XY | ±20μm |
θ | ±0.30° |
Chip components | XY | ±40μm |
θ | ±3.00° |
Portrait recognition | High precision components | XY | ±20μm |
θ | ±0.15° |
IC components | XY | ±30μm |
θ | ±0.30° |
components in high-speed *2*3 | Laser identification | High precision components | 1,600CPH |
chip | 10,000CPH |
Portrait recognition | High precision components | 1,300CPH |
IC components | 2,500CPH |
Element types | 80 or more |