1 In addition to machine complex shapes corresponding to the opposite sex IC or components, it also has a small component of high-speed placement capacity.

 ■ 12,500 CPH: chip (laser identification / actual production efficiency)

 ■ 1,850 CPH: IC (Image Recognition / actual production efficiency),

 3,400 CPH: IC (Image Recognition / use MNVC)

 ■ Laser stickers titles × 1 (4 nozzle) & high-resolution visual placement head × 1 (1 nozzle)

 ■ 0603 chip (0201) ~ 33.5mm square components

 0402 (01005) as a factory option

 ■ Image Recognition (reflection / via pattern recognition, the ball recognition, segmentation recognition)

 M Substrate substrate size (330 × 250mm) ○

 L substrate with (410 × 360mm) ○

 Lwide (510 × 360mm) ○

 E substrate with (510 × 460mm) * 1 ○

 0603 chip component size laser Recognition (0201) ~ 33.5mm square components

 Image Recognition 1.0 × 0.5mm * 2 ~ 74mm square components

 Or 50 × 150mm

 (0402 (01005) required option) * 9

 Component placement speed of 12,500 CPH * 3-chip components

 IC Components 1,850 CPH * 3 * 4

 3,400 CPH * 5

 Component placement accuracy of ± 0.05mm laser identification

 Image recognition ± 0.03mm (using MNVC (optional) is ± 0.04mm)

 Placement up to 80 species (converted to 8mm tape) * 6

 Device size * 7 (W × D × H * 8) 1,400 × 1,393 × 1,440 mm

 Weight Approx 1,410 kg